Products

One-stop Advanced High Density
Interconnect Solutions provider

Advanced HDI PCBs

High volume, reliable advanced HDI products
with up to 16 layer any layer
 
40/40um L/S
Fine pitch BGA
Up to 77G Hz High speed material hybrid HDI
Heavy Cu, Coin and novel thermal solutions

Advanced HDI PCBs

High volume, reliable advanced HDI products
with up to 16 layer any layer
 
40/40um L/S
Fine pitch BGA
Up to 77G Hz High speed material hybrid HDI
Heavy Cu, Coin and novel thermal solutions

SLP (Substrate-like-PCB) PCBs

High volume, reliable substrate-like-PCB
(SLP) products with Modified Semi-Additive (mSAP) technology
 
30/30um L/S
Fine pitch Fan-out Wafer
Level Package with large I/OS

SLP (Substrate-like-PCB) PCBs

High volume, reliable substrate-like-PCB
(SLP) products with Modified Semi-Additive (mSAP) technology
 
30/30um L/S
Fine pitch Fan-out Wafer
Level Package with large I/OS

IC Substrates

Ultra thin, highly customized module substrates
20/40um Subtractive, 20/30um mSAP L/S
 
150um Pitch Flip-chip CSP
<0.2mm 6L Core/Coreless substrate
BT/FR5 Ultra low CTE, Low loss, LED module Application Material
2.5D Cavity, Embedded Pattern, Distributive buried capacitance and buried resistance layer
Solder-on-Pad (SOP Technology)

IC Substrates

Ultra thin, highly customized module substrates
20/40um Subtractive, 20/30um mSAP L/S
 
150um Pitch Flip-chip CSP
<0.2mm 6L Core/Coreless substrate
BT/FR5 Ultra low CTE, Low loss, LED module Application Material
2.5D Cavity, Embedded Pattern, Distributive buried capacitance and buried resistance layer
Solder-on-Pad (SOP Technology)

Flex / Flex-assembly /
Rigid Flexible (HDI) PCBs

Flex, Flex-assembly, Rigid-flex
with advanced HDI / any layer technology
 
40/40um L/S
Fine pitch devices
12um PI, 10um Coverlay ultra thin thickness
Dynamic bend / Install bend / Semi-Flex
Symetrical/Unsymmetrical structures
PI and low loss PI/LCP materials
Customized assembly and testing

Flex / Flex-assembly / Rigid Flexible (HDI) PCBs

Flex, Flex-assembly, Rigid-flex
with advanced HDI / any layer technology
 
40/40um L/S
Fine pitch devices
12um PI, 10um Coverlay ultra thin thickness
Dynamic bend / Install bend / Semi-Flex
Symetrical/Unsymmetrical structures
PI and low loss PI/LCP materials
Customized assembly and testing