AKM Meadville Technology to Attend iTGV 2025, Advancing Glass Substrate Industrialization

The 2nd International Through Glass Via (TGV) Technology Innovation and Application Forum (iTGV 2025) will be grandly held at the Shenzhen Airport Hyatt Hotel from June 26th to 27th, 2025. Co-organized by the Institute of Microelectronics of the Chinese Academy of Sciences, IEEE Electronics Packaging Society Guangzhou Chapter , and Future Semiconductor, the forum focuses on TGV technology applications in advanced packaging, optoelectronics, AI, and other cutting-edge fields, fostering global technical exchanges and industrial collaboration. Mr. Tang Jiamiao, FCBGA Product General Manager of AKM Meadville Technology, will attend as Technical Chair.

About iTGV 2025
The forum will concurrently host the Future Semiconductor Packaging Technology Exhibition, providing a platform for enterprises in semiconductor packaging, glass-based chips, glass substrates, and related equipment/materials to showcase latest processes, core equipment, and services.

AKM Meadville Technology remains committed to TGV technology trends, driving industrial chain innovation, and contributing to high-quality semiconductor industry development.