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CPCA Delegation to Visit AKMMV Operational Site in Shanghai

by | Oct 26, 2021

Xiamen Grand Opening
▲ Front Row:

Leung Kai-ming, General Manager of SME & SP (3rd from the right), Ms. Hong Fang, Secretary of CPCA (2nd from the right), Ms. Bao Han-jie, Vice Secretary of CPCA (2nd from the left), Ms. Li Qiong, Vice Secretary of CPCA and SEPCA (3rd from left, Ms. Zhang Qing-mian, Subeditor Manager of Printed Circuit Information Magazine (1st from the right), Wang Jun-tao, Manufacturing Director of SME (1st from the left).

Back Row:

Luo Yong-hong, Integration Management Director of the Group (1st from the right), Wang Xiao-wei, Engineering Director of SME (2nd from the left), Huang Wei, SME Manager of R&D Center (3rd from the left), Shi Xin-hong, Integration Management Assistant Manager of the Group (2nd from the right), Mr. Zhu Hong-yu, Information Division of CPCA (1st from the left).

26 October 2021, Shanghai – Today, it is honored to have the presence of Ms. Hong Fang, Secretary of China Printed Circuit Association (CPCA), along with Ms. Li Qiong, Vice Secretary of CPCA and Secretary of Shanghai Electronics Packaging and Circuit Association (SEPCA), Ms. Bao Han-jie, Vice Secretary of CPCA, Mr. Zhu Hong-yu, Information Division of CPCA, as well as, Ms. Zhang Qing-mian, Subeditor Manager of Printed Circuit Information Magazine, to visit the operational site of AKMMV in Songjiang District of Shanghai, namely Shanghai Meadville Electronics (SME), in showing their support of the development of small-medium enterprises in PCB industry.

At the meeting, Leung Kai-ming, General Manager of SME & SP, Luo Yong-hong, Integration Management Director of the Group, Wang Jun-tao, Manufacturing Director of SME, Wang Xiao-wei, Engineering Director of SME, Huang Wei, SME Manager of R&D Center, have introduced the robust development strategy to the guests, including supporting the principal of Industry 4.0, be going beyond of existing target of substrate production volume and share the accountability mechanism in achieving the green commitments of the two companies. Together they have examined the outlook of PCB industry relating to the internal and external factors, such as AKMMV R&D development, dual carbon goals in Mainland China, packaging prospects, increasing raw material prices and market rivalry competition.

To underpin the PCB development and take forward digital transformation in Shanghai, Ms. Li, Vice Secretary of CPCA and Secretary of SEPCA, was delegated by Shanghai Small and Medium Enterprises Development Center, to consult on the topics of employment system, talent recruitment mechanism, current tax system and patent application, and was held positive discussions with the top management of AKMMV in further.